The **ATS-10G-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "SuperGRIP" series, designed primarily for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (typically with Blue Anodized finish) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | SuperGRIP™ (Frame Clip & Plastic Clip) | | **Fin Style** | Straight Fin (provides low pressure drop) | | **Thermal Resistance** | Approx. 4.0 °C/W (at 200 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Electronic & Mechanical Design Parts #### A. The Heat Sink Body (Straight Fin Design) The core of the part is the aluminum block. The **straight fin** geometry is chosen for applications where there is a steady, unidirectional airflow. It maximizes surface area to dissipate heat from the silicon die into the surrounding air. #### B. SuperGRIP™ Attachment System Unlike traditional heat sinks that use messy thermal epoxies or permanent adhesives, this part uses a mechanical clipping system: 1. **The Plastic Frame:** A high-strength plastic frame that surrounds the electronic component. 2. **The Metal Clip:** A "horseshoe" shaped spring clip that applies constant downward pressure. 3. **No Hole Mounting:** This is critical for dense PCBs; it attaches directly to the component without requiring holes drilled into the circuit board. #### C. Thermal Interface Material (TIM) While the heat sink is the primary radiator, the **ATS-10G-101-C2-R0** is usually paired with a high-performance Phase Change Material (PCM) or a thermal pad on the base to bridge the microscopic air gaps between the chip and the aluminum. --- ### 3. Common Applications * **Telecommunications:** Cooling networking switches and routers. * **Computing:** Secondary cooling for chipsets or high-speed memory modules. * **Industrial:** Power supplies and motor controllers where vibration resistance is necessary. ---