The **ATS-10F-80-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high thermal efficiency in space-constrained environments. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.90°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 36.83mm x 46.45mm x 14.48mm | | **Fin Style** | Tapered (maxiFLOW) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the physical and thermal properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10F**: Indicates the physical footprint and fin profile. * **80**: Represents the specific height and configuration within the series. * **C2**: Refers to the **Thermal Interface Material (TIM)** and finish. In this case, it typically signifies a **T766** high-performance thermal pad or similar compound. * **R0**: Indicates the version or revision (Standard production). --- ### 3. Key Component Features #### A. Tapered Fin Design (maxiFLOW™) The "tapered" fin design is engineered to maximize surface area while minimizing pressure drop. This allows for better airflow through the fins, making it ideal for systems with high-density components where air velocity might be restricted. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™** system: * It utilizes a brass or plastic pin with a compressed spring. * It ensures a consistent, high-pressure contact between the heat sink and the component (CPU, GPU, or FPGA). * The system includes pre-drilled holes in the PCB for secure mounting. #### C. Thermal Performance The efficiency of this part is measured by its ability to dissipate heat per Watt of power. At a standard airflow of 200 LFM (Linear Feet per Minute), it offers a resistance of **1.90°C/W**, which is considered very efficient for a low-profile heat sink. --- ### 4. Common Applications * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Computing:** Industrial PC processors. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Automotive:** Electronic Control Units (ECUs) requiring vibration-resistant mounting.