The **ATS-10F-77-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W x H)** | 25.00mm x 25.00mm x 20.00mm | | **Thermal Resistance** | 9.30°C/W (@ 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### 2. Key Components & Features #### A. The Fin Design This model utilizes **Straight Fins**. Straight fins are optimized for unidirectional airflow. If the device has a fan blowing air across the board in a specific direction, this fin geometry provides a low pressure drop and efficient heat transfer. #### B. Attachment Mechanism (pushPIN™) The "pushPIN" system consists of a brass or plastic pin and a spring. * **Ease of Assembly:** It allows for quick installation to pre-drilled holes in the PCB. * **Contact Pressure:** The spring ensures constant, even pressure on the thermal interface material (TIM), which is critical for heat transfer. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Anodization increases the surface area at a microscopic level and protects the aluminum from corrosion. It also slightly improves radiative heat transfer. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **10F** | pushPIN™ Series (Standard) | | **77** | Specific dimension/geometry code | | **C2** | Thermal Performance/Material grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). For this part: * At **100 LFM** (Linear Feet per Minute) of airflow, the resistance is **9.30°C/W**. * At **600 LFM**, the resistance drops to approximately **3.30°C/W**. * *Interpretation:* The faster the air moves across the fins, the more effectively the part cools the underlying electronics.