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  • ATS-10F-75-C1-R0

  • AI
    The **ATS-10F-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" product line, engineered to provide efficient cooling for high-power semiconductors. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10F-75-C1-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 1.48°C/W (at 200 LFM) | | **Airflow Direction** | Directional (High-performance Fin design) | | **Compliance** | RoHS and REACH compliant | --- ## 2. Key Features and Components ### A. maxiFLOW™ Fin Design Unlike standard extruded heatsinks, this model uses a specialized fin geometry that increases surface area and improves air turbulence. This allows for superior heat dissipation even in environments with low-velocity airflow. ### B. pushPIN™ Attachment System The "R0" designation indicates a specific mounting kit. The **pushPIN™** system consists of: * **Compression Springs:** Provide specific pressure to ensure maximum thermal interface contact. * **Plastic/Brass Pins:** Secure the heatsink to the PCB through pre-drilled holes. ### C. Thermal Interface Material (TIM) Typically, these parts come with **chomerics T766** or a similar high-performance phase-change material pre-applied to the base. This fills microscopic air gaps between the chip and the heatsink. --- ## 3. Applications and Usage This part is generally used to cool integrated circuits (ICs) that generate significant heat, such as: * **Processors (CPUs/GPUs):** In embedded systems. * **FPGAs:** High-speed field-programmable gate arrays. * **Telecommunications:** Networking switches and routers. --- ## 4. Part Number Breakdown | Segment | Description | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10F** | Series/Product Category | | **75** | Specific design/footprint identifier | | **C1** | Blue Anodized Finish | | **R0** | Standard attachment/mounting configuration | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between C1 and C2 finish for ATS heatsinks?
    • ⤷ Can this heatsink be used with a fan instead of passive airflow?
    • ⤷ How do I calculate the correct hole diameter for the pushPIN mounting?