ATS-10F-75-C1-R0
AI

The **ATS-10F-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" product line, engineered to provide efficient cooling for high-power semiconductors.
---
## 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-10F-75-C1-R0 |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 20mm |
| **Thermal Resistance** | 1.48°C/W (at 200 LFM) |
| **Airflow Direction** | Directional (High-performance Fin design) |
| **Compliance** | RoHS and REACH compliant |
---
## 2. Key Features and Components
### A. maxiFLOW™ Fin Design
Unlike standard extruded heatsinks, this model uses a specialized fin geometry that increases surface area and improves air turbulence. This allows for superior heat dissipation even in environments with low-velocity airflow.
### B. pushPIN™ Attachment System
The "R0" designation indicates a specific mounting kit. The **pushPIN™** system consists of:
* **Compression Springs:** Provide specific pressure to ensure maximum thermal interface contact.
* **Plastic/Brass Pins:** Secure the heatsink to the PCB through pre-drilled holes.
### C. Thermal Interface Material (TIM)
Typically, these parts come with **chomerics T766** or a similar high-performance phase-change material pre-applied to the base. This fills microscopic air gaps between the chip and the heatsink.
---
## 3. Applications and Usage
This part is generally used to cool integrated circuits (ICs) that generate significant heat, such as:
* **Processors (CPUs/GPUs):** In embedded systems.
* **FPGAs:** High-speed field-programmable gate arrays.
* **Telecommunications:** Networking switches and routers.
---
## 4. Part Number Breakdown
| Segment | Description |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **10F** | Series/Product Category |
| **75** | Specific design/footprint identifier |
| **C1** | Blue Anodized Finish |
| **R0** | Standard attachment/mounting configuration |
---
- ⤷What is the difference between C1 and C2 finish for ATS heatsinks?
- ⤷ Can this heatsink be used with a fan instead of passive airflow?
- ⤷ How do I calculate the correct hole diameter for the pushPIN mounting?