The **ATS-10F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10F-50-C2-R0 | | **Heat Sink Type** | PushPIN™ - Fine Pitch | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.90°C/W (at 100 LFM) | --- ## 2. Dimensional Data Precise dimensions are critical for PCB layout and ensuring the part does not interfere with neighboring components. * **Size (L x W):** 30mm x 30mm * **Height:** 15mm (Low profile for compact builds) * **Pitch:** Fine Pitch (Optimized for high-velocity airflow) * **Mounting Holes:** Specifically spaced to match standard industry layouts for push-pin attachments. --- ## 3. Key Electronic/Thermal Features ### A. PushPIN™ Attachment System This part uses a specialized **Push-Pin and Spring** mechanism. In electronics, this is preferred over adhesive tapes because: * It provides constant pressure (Interface Pressure) for better thermal contact. * It allows for secure mounting in high-vibration environments. * It is easily removable for chip inspection or rework. ### B. Thermal Performance The "Fine Pitch" design increases the surface area available for heat transfer. The **C2** in the part number indicates a specific thermal interface material (TIM) or performance grade, while **R0** typically signifies the RoHS compliance status and revision level. ### C. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * **Increased Surface Emissivity:** Improves radiant heat transfer. * **Corrosion Resistance:** Protects the aluminum from oxidation in various operating environments. --- ## 4. Typical Applications * **Microprocessors (CPUs/GPUs):** Small form factor chips requiring active or passive cooling. * **FPGAs & ASICs:** High-speed logic chips that generate significant localized heat. * **Power Supplies:** Cooling voltage regulators or power transistors. ---