The **ATS-10F-36-C2-R0** is a specific electronic component known as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 14.82°C/W (at 100 LFM) | | **Overall Dimensions** | 36.83mm x 36.83mm | | **Height** | 15.00mm | --- ## 2. Key Electronic Features ### A. Material & Efficiency The heat sink is made of **Aluminum 6063**, which is the industry standard for heat dissipation due to its excellent thermal conductivity and lightweight properties. The **Blue Anodized** finish isn't just aesthetic; it provides a protective layer against corrosion and slightly increases emissivity. ### B. Fin Design This model utilizes **Straight Fins**. * **Purpose:** Optimized for high-velocity air cooling environments. * **Airflow:** The spacing between the fins is designed to minimize pressure drop while maximizing the surface area exposed to the air. ### C. Mounting Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the "push-pin" system uses pre-drilled holes in the PCB. * **Pressure:** Uses a brass or plastic pin with a stainless steel spring. * **Stability:** This provides consistent pressure between the heat sink and the electronic component, which is vital for maintaining a good thermal interface. --- ## 3. Physical Layout (Dimensions) | Dimension | Measurement (mm) | | :--- | :--- | | **Length (L)** | 36.83 | | **Width (W)** | 36.83 | | **Height (H)** | 15.00 | | **Pitch (P)** | 40.00 (distance between pins) | --- ## 4. Typical Applications This component is generally found in: 1. **Networking Hardware:** Routers and switches where ASICs require cooling. 2. **Power Supplies:** Cooling voltage regulators or MOSFETs. 3. **Embedded Systems:** Industrial PCs or IoT gateways.