The **ATS-10F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in tight spaces with low pressure drop. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 5.84mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.01 °C/W (at 200 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Design Characteristics The part is engineered for efficiency in cooling Surface Mount Technology (SMT) components: * **Finned Design:** Uses a high-aspect-ratio fin design that increases the surface area for heat dissipation without significantly increasing the footprint. * **pushPIN™ Attachment:** This system features a flexible, high-performance attachment mechanism that provides uniform pressure across the component for optimal heat transfer. * **Thermal Interface Material (TIM):** Typically comes pre-applied with high-performance thermal tape or grease (represented by the "C2" suffix) to ensure a low-resistance path from the chip to the metal. --- ### 3. Part Number Breakdown The nomenclature for this part tells us exactly what it is: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10F** | Series Designator (maxiFLOW with specific fin geometry) | | **35** | Dimension code (approximate width in mm) | | **C2** | Thermal Interface Material (TIM) and finish type | | **R0** | Revision code / Packaging indicator | --- ### 4. Applications The ATS-10F-35-C2-R0 is commonly used in hardware environments where air cooling is the primary method of heat rejection: 1. **Telecommunications:** Cooling of high-speed processors and FPGAs in networking switches. 2. **Computing:** Integrated circuits (ICs) on motherboards or expansion cards. 3. **Industrial:** Power supplies and motor controllers where vertical height is limited.