The **ATS-10F-34-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance "push pin" heat sink series designed for thermal management in electronic circuits. --- ## 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Thermal Management) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 57.90mm x 60.96mm x 22.86mm | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Fin Style** | High-performance cross-cut (Fine Pitch) | | **Thermal Resistance** | 3.81°C/W @ 200 LFM (Linear Feet per Minute) | | **Mounting Hole Pattern** | 4-hole pattern (Universal) | --- ## 2. Key Components & Materials The ATS-10F-34-C2-R0 is engineered with specific materials to ensure maximum heat dissipation: ### A. The Heat Sink Body * **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity. * **Anodized Finish:** The "C2" suffix indicates a **Blue Anodized** finish, which increases surface area slightly and protects the aluminum from corrosion and electrical conductivity on the surface. ### B. The Attachment Mechanism * **Push Pins:** Made of brass, these provide a secure mechanical connection to the PCB. * **Springs:** The "R0" designation refers to the specific tension of the springs, ensuring constant pressure between the heat sink and the processor/chip. ### C. Thermal Interface Material (TIM) * Typically, these units come pre-applied with **ATS-specific thermal tape or phase-change material** to fill microscopic air gaps between the component and the heat sink. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying its function: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **10F** | Series: Push-pin heat sink style | | **34** | Dimensional code (specific to size footprint) | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision/Hardware configuration (Specific spring/pin type) | --- ## 4. Typical Applications This part is commonly used to cool high-heat electronic components such as: * **FPGA** (Field Programmable Gate Arrays) * **ASIC** (Application-Specific Integrated Circuits) * **Processors/CPUs** in embedded systems * **Network Switches** and high-speed communication hardware