The **ATS-10F-33-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Fin Style** | Straight Fin (provides low pressure drop) | | **Thermal Resistance** | ~17.42 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Component Breakdown The part consists of three primary electronic/mechanical sub-elements: #### A. The Heat Sink Body Manufactured from lightweight aluminum, the body uses a **Straight Fin** design. This is ideal for systems where airflow is consistent, allowing air to pass through the fins easily to carry away heat from the semiconductor package. #### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or fragile clips, this part uses **brass push-pins** with a built-in compression spring. * **Purpose:** Ensures a consistent "pressure-fit" against the electronic chip. * **Reliability:** Prevents the heat sink from shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **ATS-91** thermal interface material. * **Function:** This is a high-performance phase-change material or thermal grease that fills microscopic air gaps between the chip surface and the heat sink base to maximize heat transfer. --- ### 3. Usage Scenarios This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processing units in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Prototyping:** Used on development boards where frequent assembly/disassembly might occur due to the reusable nature of push-pins. --- ### 4. Thermal Performance Comparison *Under different airflow conditions (LFM = Linear Feet per Minute):* ```text Airflow Rate (LFM) | Thermal Resistance (°C/W) ----------------------------------------------- 100 (0.5 m/s) | 17.42 300 (1.5 m/s) | 5.92 500 (2.5 m/s) | 4.22 ```