The **ATS-10F-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10F-31-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimensions (L x W)** | 57.9mm x 36.83mm | | **Height** | 6.00mm | | **Thermal Resistance** | 25.25°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the cooling characteristics: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **10F:** Series identifier for the specific fin geometry and spacing. * **31:** Size/Dimension code for the base footprint. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision or packaging identifier. --- ### 3. Key Electronic Functions & Components This part is not an active electronic component (like a transistor) but a **passive thermal component** essential for the longevity of active electronics. #### A. Heat Dissipation Mechanism The heat sink uses **convection** to transfer heat from a high-power component (like a CPU, GPU, or FPGA) to the surrounding air. The "10F" series features a high-density fin structure to maximize surface area within a low-profile 6mm height. #### B. Attachment System (Push Pins) Instead of using adhesive tape or screws, this part uses a **spring-loaded push pin mechanism**. * **Benefits:** Provides consistent pressure on the chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Mounting:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (T766) The "C2" variant usually comes with **T766** pre-applied to the base. This is a phase-change material or high-performance pad that fills microscopic air gaps between the chip surface and the heat sink base to lower thermal impedance. --- ### 4. Application Use-Cases * **Network Switches/Routers:** Cooling high-speed processors in slim rack-mount enclosures. * **Embedded Systems:** Used where vertical space is limited (only 6mm high). * **Power Supplies:** Cooling MOSFETs or voltage regulators.