The **ATS-10F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary technical characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 11.95°C/W (at 100 LFM) to 2.30°C/W (at 700 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | XCUT (Cross-cut) | | **Dimensions** | 40mm x 40mm x 10mm | --- ## 2. Component Breakdown ### A. Material and Coating The unit is made from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The "C2" suffix indicates a **Blue Anodized** finish. This coating not only provides corrosion resistance but also improves emissivity for better radiant heat transfer. ### B. XCUT Fin Design This model uses a cross-cut (XCUT) fin pattern. This design is highly efficient for: * **Omnidirectional Airflow:** It works effectively regardless of which direction the fan or air intake is blowing. * **Turbulence:** The gaps between fins break up laminar air flow, increasing heat transfer efficiency. ### C. Mounting Mechanism (pushPIN™) The "10F" and "R0" designations relate to the mounting hardware. * **Push-Pins:** This part uses a spring-loaded push-pin system. This ensures consistent pressure (clamping force) on the electronic chip, which is critical for maximizing the effectiveness of the Thermal Interface Material (TIM). * **Springs:** Usually stainless steel or brass, providing durability under high-vibration environments. --- ## 3. Thermal Performance The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 11.95 | | 300 | 4.40 | | 500 | 3.11 | | 700 | 2.30 | --- ## 4. Typical Applications * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Embedded Systems:** Industrial PCs where space is limited (10mm low profile). * **Networking:** Cooling ASICs in routers and switches.