The **ATS-10F-18-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their **maxiFLOW™** series of high-performance heat sinks designed for cooling electronic components, primarily BGA (Ball Grid Array) packages. ### 1. Component Specifications Below is a breakdown of the technical characteristics for this specific part number: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-10F-18-C2-R0 | | **Component Type** | Heat Sink | | **Thermal Resistance** | 1.87 °C/W @ 200 LFM | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 36.83 x 36.83 x 17.78 mm | | **Fin Style** | maxiFLOW (Tapered Fin) | --- ### 2. Key Electronic & Physical Design Features #### A. Fin Geometry (maxiFLOW™) The "F" in the part number denotes the **maxiFLOW** design. Unlike standard square fins, these have a tapered profile. This design: * Reduces pressure drop across the heat sink. * Increases surface area for convection. * Is optimized for high-velocity airflow environments (like server chassis). #### B. pushPIN™ Attachment The "R0" suffix indicates the attachment mechanism. This part uses a **pushPIN™** system which includes: * A brass or plastic pin with a compressed spring. * This provides a specific, reliable pressure (clamping force) on the chip to ensure optimal thermal interface material (TIM) performance. * It eliminates the need for messy adhesives or tapes. #### C. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and light weight. * **Blue Anodized:** The surface treatment is not just aesthetic; anodizing protects the aluminum from corrosion and slightly increases emissivity for better radiant heat transfer. --- ### 3. Thermal Performance Data The cooling efficiency depends on the air velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.87 | | 300 (1.5 m/s) | 1.45 | | 400 (2.0 m/s) | 1.25 | | 500 (2.5 m/s) | 1.10 | --- ### 4. Application Use Cases This component is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Server CPUs, GPUs, or high-performance FPGAs. 3. **Power Electronics:** Cooling MOSFET arrays or power modules where space is limited but heat density is high.