The **ATS-10F-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is part of the "push pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). --- ### 1. Technical Specifications | Parameter | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Category** | Heat Sinks | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance** | 3.32°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design and Construction The part is engineered for efficient heat dissipation from electronic components like CPUs, GPUs, or power transistors. * **Heat Sink Body:** Made from aluminum for a balance of lightweight construction and high thermal conductivity. * **Fin Configuration:** It features a straight fin pattern. This is optimized for **forced-air cooling** (fan-driven) environments where air can flow directly through the channels. * **Base (Flatness):** The bottom surface is machined flat to ensure maximum surface contact with the component (usually via a Thermal Interface Material). --- ### 3. Attachment Mechanism: pushPIN™ One of the defining features of the `C2-R0` variant is its mounting system: 1. **Push-Pins:** It utilizes flexible pins that snap into pre-drilled holes in the PCB. This provides consistent pressure for thermal contact without requiring specialized tools. 2. **Compression Springs:** Each pin is equipped with a spring. This ensures the heat sink is held firmly against the chip, compensating for vibration and thermal expansion/contraction. 3. **R0 Suffix:** Usually denotes the specific material of the push-pin (e.g., plastic) and the specific Thermal Interface Material (TIM) pre-applied to the base (often a high-performance phase-change material or tape). --- ### 4. Thermal Performance Overview Thermal resistance indicates how effectively the part moves heat away from the silicon. Lower numbers are better. * **@ 100 LFM (Linear Feet per Minute):** 3.32 °C/W * **@ 500 LFM:** 1.34 °C/W This demonstrates that the part is significantly more effective as the airflow velocity increases, making it ideal for server racks or high-density enclosures with active cooling. ---