The **ATS-10F-15-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the device: | Property | Description / Value | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Thermal Resistance (Flow)** | 7.44 °C/W @ 100 LFM (Linear Feet per Minute) | | **Thermal Resistance (Static)** | 1.45 °C/W @ 500 LFM | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 25mm | | **Pitch** | Fine Pitch | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration of the part: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10**: Part of the product family. * **F**: Fin pitch/pattern (Fine pitch design). * **15**: Height of the heat sink (usually in mm or a specific series code). * **C2**: Material and Finish code (typically Aluminum with Blue Anodize). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic/Mechanical Features #### A. Fin Design This part utilizes a **Fine Pitch** fin geometry. This increases the surface area available for heat dissipation, making it ideal for systems with high-speed airflow where thermal density is a concern. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or complex screws, this part uses the pushPIN™ system: * **Spring Mechanism:** Provides precise pressure (Force) to ensure optimal contact with the thermal interface material (TIM). * **Ease of Assembly:** Features a flexible attachment kit that simplifies installation on the PCB. #### C. Thermal Interface Material (TIM) The "C2" series often comes pre-applied with high-performance thermal grease or phase-change material, ensuring that the air gaps between the component (CPU/GPU) and the heat sink are minimized. --- ### 4. Typical Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Thermal management for high-performance microcontrollers. * **Power Supplies:** Dissipating heat from power transistors (MOSFETs/IGBTs).