The **ATS-10F-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, and GPUs in space-constrained environments. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Number** | ATS-10F-142-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin with Springs | | **Thermal Interface** | Pre-applied Phase Change Material (T766) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and ensuring clearance from surrounding components. | Dimension | Value | | :--- | :--- | | **Length** | 30.00 mm | | **Width** | 30.00 mm | | **Height** | 15.00 mm | | **Fin Pitch** | Fine | --- ### 3. Key Features & Components #### A. Push-Pin Mounting System This model uses a **brass push-pin** mechanism. * **Springs:** Provides consistent pressure to ensure the base of the heat sink remains in perfect contact with the electronic component. * **Stability:** It is more secure than adhesive "peel-and-stick" solutions, making it ideal for high-vibration environments. #### B. Cross-Cut Fin Design The fins are designed in a grid-like "cross-cut" pattern. This increases the total surface area and allows for **omni-directional airflow**, meaning the cooling efficiency is maintained regardless of which direction the air is blowing from a system fan. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates a high-performance thermal interface material is pre-applied. In this case, it typically uses **T766**, which fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 4. Thermal Performance The efficiency of this heat sink depends on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 4.72 | | **400 (2.0 m/s)** | 2.96 | | **600 (3.0 m/s)** | 2.49 | --- ### Summary The **ATS-10F-142-C2-R0** is a professional-grade cooling solution for 30mm x 30mm electronic packages. It is highly valued for its mechanical reliability (push-pins) and its ability to handle significant thermal loads in a compact 15mm vertical profile.