The **ATS-10F-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Thermal Resistance** | 15.70°C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | --- ### 2. Physical Design and Features * **Heat Sink Profile:** It features a **Straight Fin** design. This is optimized for systems with a clear, directed airflow (longitudinal), allowing air to pass through the channels efficiently. * **Material:** Made from aluminum for a balance of lightweight properties and high thermal conductivity. The **Blue Anodized** coating protects against corrosion and increases emissivity. * **Attachment (pushPIN™):** Unlike adhesive-based heat sinks, this uses a mechanical "push-pin" system. This provides consistent pressure for better thermal contact and makes the part reusable or easy to replace. --- ### 3. Thermal Performance Data Thermal resistance indicates how effectively the part moves heat away from the silicon. Lower values represent better performance. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.70 | | 300 (1.5 m/s) | 9.20 | | 500 (2.5 m/s) | 7.50 | | 700 (3.5 m/s) | 6.50 | --- ### 4. Part Number Breakdown: `ATS-10F-141-C2-R0` * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **10:** Series/Style designation. * **F:** Fine pitch or specific fin density. * **141:** Specific geometry/footprint code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. --- ### 5. Common Applications * **Embedded Systems:** Compact PCBs with high-density processing. * **Telecommunications:** Networking gear (routers/switches). * **Power Supplies:** Cooling voltage regulators or power MOSFETs.