The **ATS-10F-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 30.0mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.70 °C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Fine Pitch (Cross-cut) | --- ### Key Features and Component Breakdown #### 1. Heat Sink Design (Cross-Cut Fins) The "Fine Pitch" cross-cut pattern increases the surface area available for heat transfer. This design is optimized for environments with high-velocity airflow (ducted or unducted), allowing air to pass through multiple directions. #### 2. pushPIN™ Attachment Mechanism Unlike adhesive tapes that can fail over time, the **pushPIN™** system uses: * **Compression Springs:** Provide precise pressure to the interface. * **Plastic or Brass Pegs:** Secure the sink to pre-drilled holes in the PCB. * **Reliability:** Ensures a consistent thermal interface material (TIM) contact. #### 3. Material and Finish * **AL6063 Aluminum:** Chosen for its excellent balance of thermal conductivity and weight. * **Blue Anodized Coating:** Provides corrosion resistance and increases emissivity for better radiant heat transfer. #### 4. Thermal Interface Material (TIM) The part usually comes pre-applied with **T766** thermal grease or a similar phase-change material. This fills the microscopic air gaps between the heat sink base and the electronic component, significantly reducing thermal resistance. --- ### Use Cases * **BGA (Ball Grid Array) Cooling:** Primarily used for small processors and chipsets. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Networking Equipment:** Used in routers and switches where constant operation generates high heat.