The **ATS-10F-129-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications The part number itself contains encoded information regarding its dimensions, thermal performance, and material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10F-129-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass Springs) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Design & Engineering The ATS-10F-129-C2-R0 is engineered for maximum heat dissipation in space-constrained environments. * **Fins:** It features a **Straight-Fin** design. This is optimal for systems with a defined airflow direction, allowing air to pass through the channels and carry heat away from the base. * **Low Profile:** With a height of only **10mm**, it is ideal for "1U" server chassis or low-profile consumer electronics. * **Attachment (pushPIN™):** This model uses a specialized push-pin system. This ensures a secure, high-pressure fit against the component, which is critical for efficient heat transfer. --- ### 3. Material and Finish The choice of materials affects both longevity and thermal conductivity: * **AL6063 Aluminum:** Offers an excellent balance between weight, cost, and high thermal conductivity. * **Blue Anodized Coating:** This is not just for aesthetics; anodizing increases the surface area at a microscopic level and protects the aluminum from corrosion and electrical conductivity on the surface. --- ### 4. Thermal Performance Comparison Thermal performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 11.2 | | 200 | 8.68 | | 300 | 7.15 | | 400 | 6.20 | --- ### 5. Application Examples * **Networking Gear:** Routers, switches, and base stations. * **Computing:** High-speed processors or FPGAs (Field Programmable Gate Arrays). * **Power Supplies:** Cooling voltage regulators or power transistors.