The **ATS-10F-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. ### Technical Specifications | Parameter | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 50mm x 50mm | | **Height (Height off base)** | 25mm | | **Fin Style** | Fine Pitch (XC-Cut) | | **Thermal Resistance** | 3.28°C/W (at 100 LFM) | --- ### Key Features and Design #### 1. Material and Coating The unit is constructed from high-grade aluminum, which offers an excellent balance between weight and thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiative heat transfer. #### 2. Fine-Pitch Fin Design The "XC-Cut" or fine-pitch fin geometry maximizes the surface area within a compact 50mm x 50mm footprint. This design is optimized for environments where there is forced air cooling (fans), as it allows for efficient airflow through the fins. #### 3. Attachment Mechanism: pushPIN™ This specific model uses a **pushPIN™** system. This consists of: * **Brass or Plastic Pins:** To secure the sink to the PCB. * **Compression Springs:** These ensure consistent and precise pressure is applied to the electronic component, which is critical for the effectiveness of the Thermal Interface Material (TIM). #### 4. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the heat sink comes with a pre-applied **Phase Change Material** or high-performance thermal pad. This fills microscopic air gaps between the component and the heat sink base to lower thermal resistance. --- ### Application Usage This part is commonly found in: * **Networking Equipment:** Routers and switches with high-speed processing chips. * **Industrial PCs:** Compact systems requiring reliable passive or active cooling. * **Power Supplies:** Cooling MOSFETs or voltage regulators that generate significant heat during operation.