The **ATS-10F-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications Below is a breakdown of the key parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Thermal Resistance** | 9.48°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Fine Pitch (Straight Fins) | --- ### 2. Component Breakdown #### A. The pushPIN™ Attachment System The "121" in the part number identifies the specific attachment configuration. This model uses a **push-pin and spring mechanism**. This is superior to adhesive tapes because: * It provides constant pressure (interface load) for better thermal conductivity. * It allows for easy removal and re-application during maintenance. #### B. Material and Thermal Conductivity The sink is made of **Aluminum 6063**. While copper has higher conductivity, aluminum is used here to reduce weight and cost while providing sufficient surface area via its fin design. The **Blue Anodized** finish isn't just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. #### C. Performance Characteristics The effectiveness of this heat sink is highly dependent on airflow (measured in Linear Feet per Minute - LFM): * **@ 100 LFM:** 9.48 °C/W * **@ 400 LFM:** 3.25 °C/W * **@ 700 LFM:** 2.29 °C/W --- ### 3. Part Number Decoder Understanding the nomenclature helps in selecting variations: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10F** | Fin Pitch / Style (Fine Pitch) | | **121** | Physical footprint and hole pattern | | **C2** | Thermal Interface Material (Pre-applied Phase Change Material) | | **R0** | RoHS Compliance Status | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs where space is limited (10mm height). * **Telecommunications:** Cooling of networking chips. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.