The **ATS-10F-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series, designed for precision cooling of integrated circuits (ICs) and surface-mount components. --- ### 1. Technical Specifications The part is defined by its physical dimensions, material composition, and thermal performance characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Board Level Heat Sink | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Fin Type** | Straight / Square | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~6.70°C/W (at 100 LFM) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and structural integrity. The "Blue Anodized" finish is not just aesthetic; it provides surface protection against corrosion and increases surface emissivity, which slightly improves radiation heat transfer. #### B. The pushPIN™ Attachment System This specific model uses a specialized attachment mechanism rather than thermal adhesive or screws: * **Compression Springs:** These provide a precise "push" force to ensure constant contact with the heat source. * **Plastic/Brass Pins:** These lock into pre-drilled holes on the Printed Circuit Board (PCB). * **Benefits:** This system allows for easy installation, consistent thermal interface pressure, and easy removal for maintenance. #### C. Thermal Interface Material (TIM) The **"C3"** in the part number indicates the type of Thermal Interface Material pre-applied to the base: * It typically features a high-performance thermal pad or phase-change material to bridge the microscopic air gaps between the component (CPU/GPU) and the heat sink. --- ### 3. Application Use Cases This part is typically used in environments where electronic components generate significant heat in a compact space: * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power modules. * **Telecommunications:** Base station signal processing units. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **10F:** Series/Family designator * **101:** Specific fin geometry and physical size code * **C3:** Specific Thermal Interface Material (TIM) type * **R0:** Revision or RoHS compliance status