The **ATS-10F-101-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | ~6.69°C/W (Natural Convection) | --- ### 2. Key Components & Design The "electronic parts" of this assembly consist of the mechanical interface used to protect the actual electronic circuitry (IC/CPU): * **The Heat Sink Body:** Extruded aluminum with a high surface-area-to-volume ratio. The blue anodized coating prevents oxidation and slightly improves emissivity. * **Push-Pin Mounting:** This model uses a spring-loaded plastic push-pin system. This ensures a consistent **compression force** on the electronic chip, which is vital for maintaining thermal contact without cracking the silicon die. * **Thermal Interface Material (TIM):** The "C2" in the part number typically refers to the pre-applied thermal interface material (like T766 or similar). This fills microscopic air gaps between the chip and the metal. --- ### 3. Application Use Cases This specific part is used in environments where active cooling (fans) or strong passive airflow is present: 1. **Telecommunications:** Cooling ASICs in networking switches and routers. 2. **Embedded Computing:** Managing heat for SOCs (System on Chips) in industrial controllers. 3. **Power Electronics:** Dissipating heat from high-speed FPGA units or power-dense transistors. --- ### 4. Part Number Breakdown Understanding the nomenclature helps identify its specific electronic requirements: * **ATS:** Advanced Thermal Solutions (Brand). * **10F:** Series designation (Straight Fin). * **101:** Specific geometric configuration (45mm x 45mm x 20mm). * **C2:** Thermal Interface Material type (Pre-applied phase change or pad). * **R0:** Revision code / RoHS Compliance.