The **ATS-10D-77-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It belongs to the "push-pin" series designed for securing the cooler directly to a Printed Circuit Board (PCB). --- ## 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Base Part Number** | ATS-10D-77-C2-R0 | | **Heat Sink Type** | Push-pin (Straight Fin) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | --- ## 2. Key Electronic Components & Design ### A. Fin Profile (Straight Fin) This model uses a **Straight Fin** design. In electronics, this is ideal for applications where the airflow is predictable and unidirectional. The fins increase the surface area available to dissipate heat from the underlying semiconductor (such as a BGA chip or FPGA). ### B. Attachment Mechanism: Push-Pins Unlike adhesive-based heat sinks, the "77" series uses **brass push-pins** with a compression spring. * **Reliability:** Provides constant pressure on the electronic component to ensure maximum heat transfer. * **Durability:** Unlike thermal tape, push-pins do not degrade over time due to heat cycles. ### C. Thermal Interface Material (T766) The "C2" suffix indicates the use of **T766 thermal phase-change material**. * This material fills the microscopic air gaps between the heat sink and the electronic chip. * It improves the efficiency of heat conduction from the silicon die to the aluminum fins. --- ## 3. Application Use Cases This specific part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Small form-factor industrial PCs. 3. **Power Electronics:** Voltage regulators or power converters that generate localized heat on the PCB. ---