The **ATS-10D-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series, designed for cooling integrated circuits (ICs) and other surface-mount components. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Part Number** | ATS-10D-76-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 25mm x 25mm | | **Height (Off Base)** | 10mm | | **Thermal Resistance** | ~27.3°C/W (Natural Convection) | | **Number of Fins** | Specialized Straight Fin Design | --- ### 2. Key Component Features * **pushPIN™ Attachment:** This model uses a specialized push-pin mechanism with a high-performance spring. This ensures consistent pressure on the processor, improving heat transfer and making installation repeatable without risking PCB damage. * **Thermal Interface Material (TIM):** The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-T766** high-performance thermal grease, which fills microscopic air gaps between the component and the heat sink. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly increases surface emissivity, aiding in heat radiation. * **Compact Footprint:** At 25mm x 25mm, it is designed for small-form-factor electronics where board space is at a premium. --- ### 3. Electronic Applications The ATS-10D-76-C2-R0 is commonly used to cool the following electronic parts: 1. **Microprocessors (CPUs):** Low-power embedded processors. 2. **FPGAs/ASICs:** Field Programmable Gate Arrays that generate localized heat. 3. **Video Controllers:** Small graphics or display driving chips. 4. **Power Converters:** High-density DC-DC converter modules. --- ### 4. Thermal Performance Context Thermal resistance is air-flow dependent. While it performs at ~27.3°C/W in still air, its efficiency increases significantly with forced convection (fans): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | ~11.5 | | 400 (2.0 m/s) | ~8.4 | | 600 (3.0 m/s) | ~6.9 |