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  • ATS-10D-64-C2-R0

  • AI
    The **ATS-10D-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Detail | Specification | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | ATS | | **Attachment Method** | Push Pin | Standard 2-pin attachment | | **Material** | Aluminum | Blue Anodized Finish | | **Dimensions** | 40mm x 40mm x 25mm | Standard footprint | | **Thermal Resistance** | 9.39°C/W (Unducted) | At low airflow (200 LFM) | | **Fin Type** | Straight Fin | Optimizes airflow direction | --- ### 2. Physical Design Features * **The Heat Sink Body:** It is made from high-grade aluminum. The **C2** in the part number indicates a specific blue anodized finish, which not only prevents corrosion but slightly improves thermal emissivity. * **Fin Geometry:** The straight-fin design is intended for systems with a defined direction of airflow. It provides a large surface area for heat dissipation without creating excessive back-pressure. * **The Attachment (Push Pin):** Instead of using messy thermal adhesives or complex screws, this model uses a brass push pin with a stainless steel spring. This provides consistent pressure (load) on the electronic chip, ensuring optimal thermal interface material (TIM) performance. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: 1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. 2. **Industrial PCs:** Compact motherboards where space is limited but height (25mm) is available. 3. **Power Supplies:** Cooling MOSFETs or power regulators that require a dedicated thermal solution. --- ### 4. Thermal Performance Profile The effectiveness of the ATS-10D-64-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static) | ~9.39 | | 300 (Moderate) | ~3.33 | | 500 (High) | ~2.50 | *Note: Lower °C/W is better, as it indicates the heatsink is more efficient at moving heat away from the component.*
    ✨ Follow-up Questions
    • ⤷ What are the mechanical hole patterns required for this push pin mount?
    • ⤷ How does blue anodization compare to black anodization for thermal performance?
    • ⤷ What type of Thermal Interface Material (TIM) is pre-applied to this model?