The **ATS-10D-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **blueICE™** series and is designed for cooling high-heat-generating components like CPUs, GPUs, or high-power ASICs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10D-63-C2-R0 | | **Heat Sink Type** | Push-Pin (BGA) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 20mm | | **Attachment Method** | Push-pin with a compression spring | | **Thermal Resistance** | ~2.85 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Core Electronic Components #### A. The Heat Sink Body (Passive Cooling) The body is made of **AL6063 aluminum**, chosen for its excellent thermal conductivity and lightweight properties. The "fins" increase the surface area, allowing heat to transfer from the electronic component to the surrounding air more efficiently. #### B. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, this model uses a mechanical **Push-Pin** system. * **Purpose:** Provides consistent pressure across the surface of the chip. * **Benefit:** Ensures maximum contact and reduces the risk of the heat sink detaching due to vibration or thermal expansion. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **T766 phase-change material**. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Importance:** Air is a poor conductor; the TIM ensures a low-resistance thermal path. --- ### 3. Application Use Cases This part is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **High-Speed Computing:** Cooling of chipsets and voltage regulator modules (VRMs). --- ### 4. Thermal Performance Comparison (Calculated) Heat sinks are measured by how much they resist heat flow (lower is better). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM | 2.85 | | 400 LFM | 1.47 | | 600 LFM | 1.12 |