The **ATS-10D-147-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** from the *maxiFLOW™* series. --- ### 1. Technical Specifications This part is designed for cooling electronic components like CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30mm x 30mm x 10mm | | **Thermal Resistance** | 13.52°C/W (Unducted Flow @ 200 LFM) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's build: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10D**: Indicates the internal product classification or design iteration. * **147**: Designates the specific fin pattern and size profile. * **C2**: Refers to the material and finish (Blue Anodized Aluminum). * **R0**: Indicates the revision status of the part. --- ### 3. Key Electronic/Mechanical Features #### A. Fin Design (maxiFLOW™) The part uses a **tapered fin design** which increases the surface area for heat dissipation while minimizing pressure drop. This is critical in electronics where airflow is restricted. #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses a **pushPIN™ mechanism**. This consists of: * A brass or plastic pin. * A compression spring to provide precise, uniform pressure across the component. * Reliable attachment that resists vibration and mechanical shock. #### C. Thermal Interface Material (TIM) The base is pre-coated with **T766 phase-change material**. This eliminates the need for manual application of thermal paste, ensuring a low thermal-resistance bond between the heat sink and the chip. --- ### 4. Application Use Cases * **Networking Equipment:** Used on high-speed switches and routers. * **Embedded Systems:** Ideal for compact industrial PC boards. * **Power Electronics:** Cooling MOSFETs or voltage regulators in power supplies. ---