The **ATS-10D-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for precision cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine Pitch (maximizes surface area) | | **Fin Pattern** | XC-CUT | | **Thermal Resistance** | 16.97 °C/W (Unducted) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Mounting Hole Spacing** | 38.00mm x 38.00mm | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand its specific configuration: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **10D:** Series identifier (standard high-efficiency series). * **07:** Specific fin geometry and spacing. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision or RoHS compliance status. --- ### 3. Key Component Features 1. **PushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a brass component and a stainless steel spring. This ensures even pressure across the processor, improving heat transfer. 2. **Pre-applied Thermal Interface Material (TIM):** This model typically comes with a "Thermal Pad" or pre-applied phase-change material on the base, reducing assembly time. 3. **Cross-Cut (XC) Fin Design:** The fins are cut in a grid-like pattern. This allows air to flow through the heat sink from multiple directions, making it ideal for systems where airflow direction might vary. 4. **Low Profile:** With a height of only 12.7mm, it is designed for space-constrained environments like blade servers or compact networking hardware. --- ### 4. Application Areas This component is used to prevent thermal throttling or hardware failure in: * **CPUs/GPUs:** Small form factor processors. * **FPGAs:** High-speed field-programmable gate arrays. * **ASICs:** Application-specific integrated circuits in telecommunications. ---