The **ATS-10D-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other PCB components. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | blueICE™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | Straight | | **Thermal Resistance** | 21.92°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | --- ### Key Components & Features #### 1. Heat Sink Body * **Material:** Made from high-grade aluminum, which provides excellent thermal conductivity while remaining lightweight. * **Fin Design:** Features a straight-fin pattern. This is optimized for environments with high-velocity airflow, allowing air to pass through the channels and carry heat away from the base. #### 2. Attachment System (Push-Pins) * The part uses a **Brass Push-Pin** mechanism with a high-performance compression spring. * **Advantage:** This ensures consistent pressure across the component surface, which maximizes thermal transfer and prevents the heat sink from shifting during mechanical shock or vibration. #### 3. Thermal Interface Material (TIM) * This specific model typically comes with **pre-applied phase-change material** or a high-performance thermal pad (often ATS-specific T766 or similar). * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip to reduce thermal resistance. --- ### Application Use Cases This part is commonly used in the following electronic sectors: * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Systems:** Industrial PCs and small form factor motherboards. * **Power Electronics:** Managing heat for MOSFETs or voltage regulators where space is restricted (due to its low 10mm profile). --- ### Thermal Performance Overview | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 21.92 | | 400 (2.0 m/s) | 12.01 | | 600 (3.0 m/s) | 8.45 |