The **ATS-10B-87-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific physical and material characteristics: | Feature | Specification | | :--- | :--- | | **Product Type** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.16°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. Fin Profile (Straight Fin) This model uses a **Straight Fin** design. This is optimized for systems with a clear, directed airflow path. The spacing between the fins is engineered to minimize pressure drop while maximizing the surface area available for heat transfer. #### B. pushPIN™ Attachment System Instead of using messy adhesives or unreliable clips, this part uses a **pushPIN™ system**. * **Hardware:** Includes a flexible spring and a plastic/brass pin. * **Benefits:** Ensures constant pressure (Contact Pressure) between the heat sink and the component, which is vital for thermal efficiency. It also allows for easy installation and removal without damaging the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 thermal grease**. This is pre-applied to the base of the heat sink. It fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ### 3. Thermal Performance Matrix The efficiency of this part varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 4.33 °C/W | 13.16 °C/W | | 300 (1.5 m/s) | 2.18 °C/W | 3.77 °C/W | | 500 (2.5 m/s) | 1.67 °C/W | 2.30 °C/W | --- ### 4. Application Use Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Dissipating heat from high-speed data chips. * **Power Supplies:** Managing the temperature of MOSFETs or voltage regulators.