ATS-09D-159-C1-R0
AI

The **ATS-09D-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Design and Engineering Features
### A. Push-Pin Mounting
The unit uses a "push-pin" attachment mechanism. This involves two pins and springs that lock into pre-drilled holes on the Printed Circuit Board (PCB).
* **Reliability:** Provides consistent pressure on the component for optimal heat transfer.
* **Ease of Assembly:** Can be installed quickly without specialized tools.
### B. Fin Geometry
The "159" series features a **Straight-Fin** design. This is optimized for environments with consistent airflow (active cooling) where a fan is moving air across the heat sink.
### C. Thermal Interface Material (TIM)
The base comes pre-applied with **T766**. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance.
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## 3. Performance Overview
The "C1" in the part number indicates a specific thermal performance rating. The low profile (10mm height) makes it ideal for:
1. **Compact Electronics:** 1U servers or low-profile networking equipment.
2. **Embedded Systems:** Industrial PCs where vertical space is limited.
3. **High-Heat Components:** Voltage regulators and high-speed chipsets.
---
## 4. Part Number Breakdown
```text
ATS - 09 D - 159 - C1 - R0
| | | | |
| | | | └─ Revision Code
| | | └─ Performance/Thermal Class
| | └─ Fin Design Identifier
| └─ Dimension/Attachment Series
└─ Brand (Advanced Thermal Solutions)
```
- ⤷
What are the specific hole-to-hole spacing requirements for the push-pins on this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard silicone-based pastes?
- ⤷ Is there a cross-reference for this part in a copper material for higher thermal conductivity?