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  • ATS-09D-159-C1-R0

  • AI
    The **ATS-09D-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Design and Engineering Features ### A. Push-Pin Mounting The unit uses a "push-pin" attachment mechanism. This involves two pins and springs that lock into pre-drilled holes on the Printed Circuit Board (PCB). * **Reliability:** Provides consistent pressure on the component for optimal heat transfer. * **Ease of Assembly:** Can be installed quickly without specialized tools. ### B. Fin Geometry The "159" series features a **Straight-Fin** design. This is optimized for environments with consistent airflow (active cooling) where a fan is moving air across the heat sink. ### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. --- ## 3. Performance Overview The "C1" in the part number indicates a specific thermal performance rating. The low profile (10mm height) makes it ideal for: 1. **Compact Electronics:** 1U servers or low-profile networking equipment. 2. **Embedded Systems:** Industrial PCs where vertical space is limited. 3. **High-Heat Components:** Voltage regulators and high-speed chipsets. --- ## 4. Part Number Breakdown ```text ATS - 09 D - 159 - C1 - R0 | | | | | | | | | └─ Revision Code | | | └─ Performance/Thermal Class | | └─ Fin Design Identifier | └─ Dimension/Attachment Series └─ Brand (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the specific hole-to-hole spacing requirements for the push-pins on this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard silicone-based pastes?
    • ⤷ Is there a cross-reference for this part in a copper material for higher thermal conductivity?