The **ATS-09B-101-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 30mm | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Electronic Application & Usage This part is used to dissipate heat from integrated circuits (ICs) that generate significant thermal energy during operation. * **Target Components:** High-power CPUs, GPUs, FPGAs, and power transistors. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **Phase Change Material (T766)**, which fills microscopic air gaps between the chip and the heatsink to maximize heat transfer. * **Attachment Logic:** The "pushPIN" system uses a spring-loaded mechanism that ensures a constant, specific pressure (load) on the electronic component, preventing damage while maintaining thermal contact. --- ### 3. Thermal Performance Analysis The efficiency of the heatsink varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.69 | | 200 (1.0 m/s) | 2.01 | | 400 (2.0 m/s) | 1.15 | | 600 (3.0 m/s) | 0.84 | --- ### 4. Part Number Breakdown * **ATS**: Manufacturer (Advanced Thermal Solutions). * **09**: Fin Pitch/Style code. * **B**: Material/Base type. * **101**: Physical size identifier. * **C2**: Thermal Interface Material (T766) and finish code. * **R0**: RoHS Compliant / Revision code.