The **ATS-08H-89-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Key Technical Specifications The model number encodes specific physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Thermal Resistance** | 3.94°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Fin Type** | Straight Fin | | **Flow** | High Flow / Directional | --- ## 2. Electronic Application Parts To understand how this part functions within an electronic assembly, it is broken down into three main sections: ### A. The Heat Sink Body The body is made of **6063-series aluminum**. Aluminum is chosen for its excellent thermal conductivity and light weight. The "Blue Anodized" finish isn't just for aesthetics; it provides a protective layer against corrosion and slightly improves radiant heat emission. ### B. The push-PIN™ Mounting System Unlike adhesive tapes that can fail over time, the **ATS-08H-89-C2-R0** uses a mechanical push-PIN system: * **Compression Springs:** These ensure constant pressure between the heat sink and the electronic component (IC), which is critical for maximizing thermal transfer. * **Plastic/Brass Pins:** These lock into pre-drilled holes on the Printed Circuit Board (PCB). ### C. Thermal Interface Material (TIM) Typically, these units come with **pre-applied phase-change material** or high-performance thermal grease on the base. This fills the microscopic air gaps between the heat sink and the silicon chip, significantly reducing thermal resistance. --- ## 3. Performance Metrics Electronic designers select this part based on its performance across different airflow speeds (measured in Linear Feet per Minute - LFM): * **@ 1.0 m/s (200 LFM):** 3.94°C/W * **@ 2.0 m/s (400 LFM):** 1.84°C/W * **@ 3.0 m/s (600 LFM):** 1.48°C/W *Note: A lower °C/W value indicates better cooling efficiency.* ---