The **ATS-08H-41-C2-R0** is a specific electronic component categorized as a **high-performance heat sink**. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "push pin" attachment series designed for cooling semiconductor devices like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | XCUT (Cross-cut) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 17.78mm | | **Thermal Resistance** | 10.03°C/W (at 100 LFM) | | **Fin Pitch** | Fine-pitch straight fin | --- ### 2. Design Characteristics This part is engineered for specific electronic cooling requirements: * **Heat Sink Profile:** The "XCUT" design allows for multi-directional airflow. Unlike straight-fin heat sinks that require air to flow in one specific direction, cross-cut fins can dissipate heat effectively even if the airflow direction is inconsistent. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a high-performance thermal pad, ensuring low thermal resistance between the component and the sink. * **Material Choice:** Aluminum is used for its excellent weight-to-thermal-conductivity ratio, and the **Blue Anodized** finish increases surface emissivity and provides corrosion resistance. --- ### 3. Attachment Mechanism: Push-Pin & Spring The "R0" suffix often indicates the specific hardware kit included. This part uses a mechanical fastening system rather than adhesive: 1. **Push-Pins:** Plastic pins that snap into pre-drilled holes on the Printed Circuit Board (PCB). 2. **Compression Springs:** These sit between the pin head and the heat sink, providing a consistent "clamping force." This ensures the heat sink remains flat against the chip, which is critical for thermal transfer. --- ### 4. Typical Applications Because of its 45mm x 45mm footprint, this part is commonly used for: * **Northbridge/Southbridge** chipsets on motherboards. * **Network Switches** and high-speed routers. * **Industrial Power Supplies** where passive or active airflow is present.