ATS-08F-98-C2-R0
AI

The **ATS-08F-98-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices.
### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Property | Description |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Heat Sink Type** | Push-Pin / Cross-Cut Fin |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Thermal Resistance** | 15.31 °C/W (Unducted @ 100 LFM) |
| **Attachment Method** | Push-Pin (Plastic) with Compression Spring |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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### 2. Key Design Features
* **Cross-Cut Fin Design:** The "fins" are cut in both vertical and horizontal directions. This maximizes surface area and allows air to flow through the heat sink from multiple directions, making it more efficient in environments with inconsistent airflow.
* **Push-Pin Attachment:** This model uses a plastic push-pin mechanism. This provides a secure, vibration-resistant mount to the PCB (Printed Circuit Board) compared to simple adhesive tapes.
* **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a phase-change material that melts when the component gets hot, filling microscopic gaps between the chip and the heat sink for optimal heat transfer.
* **Blue Anodization:** This is not just for aesthetics; the anodized coating increases surface emissivity and provides a layer of electrical insulation and corrosion resistance.
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### 3. Application Use Cases
The ATS-08F-98-C2-R0 is typically used in the following electronic systems:
1. **Network Switches/Routers:** Cooling high-speed processing ASICs.
2. **Embedded Systems:** For industrial computers that require ruggedized cooling.
3. **Power Supplies:** Cooling MOSFETs or power regulators that generate significant heat in a small footprint.
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- ⤷
What are the PCB hole requirements for the push-pin mounting system?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Is it possible to replace the pre-applied T766 interface with a different thermal paste?