ATS-08F-47-C2-R0
AI

The **ATS-08F-47-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance "push pin" heat sink series designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
|:---|:---|
| **Part Number** | ATS-08F-47-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height** | 20mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Component Breakdown
### A. Material and Design
The heat sink is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The **Blue Anodized** finish is not just aesthetic; it provides a layer of protection against corrosion and slightly improves radiant heat emission.
### B. The "Push-Pin" Mechanism
Unlike adhesive-based heat sinks, the "R0" version uses a mechanical fastening system:
- **Plastic Push-Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB).
- **Compression Springs:** These ensure constant downward pressure on the component, improving contact with the heat source and preventing the heat sink from shifting during vibration.
### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This is a "Phase Change" material that fills microscopic air gaps between the chip and the heat sink once it reaches operating temperature, significantly reducing thermal resistance.
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## 3. Thermal Performance Indicators
Performance varies based on airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
|:---|:---|
| 200 (1.0 m/s) | ~9.03 |
| 400 (2.0 m/s) | ~5.47 |
| 600 (3.0 m/s) | ~4.20 |
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## 4. Part Number Decoder
Understanding the "ATS" nomenclature:
- **ATS-08**: Series identifier.
- **F**: Fin pattern/density.
- **47**: Height/Dimension code.
- **C2**: Material/Finish code (Blue Anodized).
- **R0**: Revision/Attachment type (Push-pin).
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- ⤷
What are the PCB hole size requirements for the push-pins in this model?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink that uses wire clips instead of push-pins?