The **ATS-08F-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the device. | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.02°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Fin Style** | Fine Pitch (XC Cut) | --- ### 2. Physical Design Features #### A. XC Cut Fin Profile The "XC Cut" refers to a cross-cut fin design. Unlike straight-fin heat sinks, the cross-cut design allows for **multi-directional airflow**. This is crucial in compact electronic enclosures where air may not flow in a perfectly linear path. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or fragile clips, this model uses a **push-pin and spring mechanism**. * **Benefits:** Provides consistent pressure (preload) across the component surface for optimal thermal transfer. * **Installation:** Requires pre-drilled holes on the PCB (typically 3.0mm diameter). #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the unit comes with **pre-applied thermal interface material** (often a high-performance phase-change material or thermal pad) on the base, ensuring a low-resistance path between the chip and the aluminum. --- ### 3. Electronic Application Use-Cases This heat sink is typically used for cooling small to medium-sized electronic components such as: * **BGA (Ball Grid Array) Packages:** CPUs, GPUs, or high-speed memory. * **Voltage Regulators:** VRMs and power management ICs. * **FPGA/ASIC:** Field Programmable Gate Arrays used in networking equipment. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **08** | Specific series/pin dimensions | | **F** | Fine pitch fin configuration | | **45** | Dimension/Variation code | | **C3** | Blue Anodized Finish | | **R0** | Package/TIM specific code |