The **ATS-08F-32-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 21.46°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 54mm x 54mm | | **Height** | 12.70mm | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the physical characteristics of the heat sink: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **08**: Internal series designation. * **F**: Fin pitch/style (likely Fine or specific geometry). * **32**: Specific physical size/configuration code. * **C2**: Material and Finish code (typically Aluminum with Blue Anodized finish). * **R0**: Revision or packaging code. --- ### 3. Key Features and Mechanical Design #### A. Fin Geometry The heat sink features a **cross-cut design**, which allows for multi-directional airflow. This is critical in cramped electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. #### B. Attachment (Push-Pin) Instead of adhesive tape or clips, this unit uses a **brass push-pin system** with a compression spring. * **Benefits**: Ensures consistent pressure on the component for optimal heat transfer. * **Reliability**: Provides a secure mechanical connection that resists vibration and shock. #### C. Thermal Interface Material (TIM) The "C2" variant comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the component, significantly reducing thermal impedance. --- ### 4. Typical Applications * **Networking Gear**: Routers and high-speed switches. * **Industrial PCs**: Cooling processors in fanless or high-airflow environments. * **Power Supplies**: Managing heat for MOSFETs or power ICs. * **Embedded Systems**: Providing cooling for SoCs (System on Chips).