công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-08F-27-C2-R0

  • AI
    The **ATS-08F-27-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the key mechanical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | XCUT (Cross-cut) | | **Dimensions** | 70.00mm x 70.00mm | | **Height** | 12.70mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.24 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics This component is engineered for specific airflow conditions and mounting reliability: * **XCUT Fin Pattern:** The cross-cut fin geometry allows for omnidirectional airflow. This means the heat sink performs efficiently regardless of which direction the cooling air is coming from. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin system. This provides consistent pressure (7-10 lbs) on the electronic component, ensuring maximum heat transfer and mechanical stability. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases The ATS-08F-27-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking ASICs and high-speed processors. 2. **Embedded Systems:** Industrial PCs where vertical clearance is limited (only 12.7mm high). 3. **Power Electronics:** Dissipating heat from MOSFETs or power modules. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow speed (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 12.24 | | 300 | 1.5 | 2.49 | | 500 | 2.5 | 1.43 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between XCUT and Straight Fin heat sinks?
    • ⤷ How do I calculate the required airflow for this heat sink?
    • ⤷ Can the pushPIN mounting be adjusted for different PCB thicknesses?