ATS-08F-209-C2-R0
AI

The **ATS-08F-209-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on printed circuit boards (PCBs).
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Heat Sink Type** | XC-Cut (Cross-cut) |
| **Dimensions (L x W x H)** | 70mm x 70mm x 10mm |
| **Pitch (Mounting Holes)** | 63mm x 63mm |
| **Thermal Resistance** | 6.27 °C/W (at 100 LFM) |
| **Thermal Interface Material** | T766 (High-performance grease) |
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### 2. Component Features
* **XC-Cut Design:** The "XC" indicates a cross-cut fin pattern. This design allows for multidirectional airflow, making it highly effective in systems where air direction may change or is turbulent.
* **Low Profile:** With a height of only 10mm, this part is ideal for height-constrained environments like 1U rack servers or slim embedded systems.
* **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a spring-loaded pin mechanism. This ensures consistent pressure (clamping force) on the chip, which optimizes thermal transfer.
* **Blue Anodized Coating:** The surface treatment improves radiation heat transfer and provides corrosion resistance.
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### 3. Application Use Cases
This component is typically used in the following electronic sectors:
1. **Telecommunications:** Cooling ASICs in routers and switches.
2. **Embedded Systems:** Industrial PCs where vertical space is limited.
3. **Power Electronics:** Dissipating heat from high-current MOSFETs or power modules.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (LFM - Linear Feet per Minute):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 6.27 |
| 300 | 1.5 | 3.46 |
| 500 | 2.5 | 2.62 |
| 700 | 3.5 | 2.21 |
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What is the difference between the C1
- ⤷ C2
- ⤷ and C3 variants of this heat sink?
- ⤷ Can the pushPIN attachment be replaced with adhesive tape?
- ⤷ What are the specific dimensions of the mounting holes required on the PCB?