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  • ATS-08F-209-C2-R0

  • AI
    The **ATS-08F-209-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on printed circuit boards (PCBs). --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Heat Sink Type** | XC-Cut (Cross-cut) | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Pitch (Mounting Holes)** | 63mm x 63mm | | **Thermal Resistance** | 6.27 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (High-performance grease) | --- ### 2. Component Features * **XC-Cut Design:** The "XC" indicates a cross-cut fin pattern. This design allows for multidirectional airflow, making it highly effective in systems where air direction may change or is turbulent. * **Low Profile:** With a height of only 10mm, this part is ideal for height-constrained environments like 1U rack servers or slim embedded systems. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a spring-loaded pin mechanism. This ensures consistent pressure (clamping force) on the chip, which optimizes thermal transfer. * **Blue Anodized Coating:** The surface treatment improves radiation heat transfer and provides corrosion resistance. --- ### 3. Application Use Cases This component is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited. 3. **Power Electronics:** Dissipating heat from high-current MOSFETs or power modules. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.27 | | 300 | 1.5 | 3.46 | | 500 | 2.5 | 2.62 | | 700 | 3.5 | 2.21 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 variants of this heat sink?
    • ⤷ Can the pushPIN attachment be replaced with adhesive tape?
    • ⤷ What are the specific dimensions of the mounting holes required on the PCB?