The **ATS-08F-186-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 2.80°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Fine-Pitch (Cross-Cut) | | **Finish** | Blue Anodized | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal properties: * **ATS-08**: Refers to the specific series/category within the ATS catalog. * **F**: Likely indicates the fin density or specific extrusion type (Fine pitch). * **186**: Internal design code for the specific thermal profile. * **C2**: Indicates the Thermal Interface Material (TIM) pre-applied (usually **T766** high-performance grease). * **R0**: Refers to the RoHS compliance status and revision level. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), its role in an electronic circuit is critical: 1. **Thermal Dissipation:** It increases the surface area of the component it is mounted on, allowing air to carry away heat more efficiently. 2. **Cross-Cut Design:** The "Fine-Pitch" cross-cut pattern allows for multi-directional airflow, making it effective even if the cooling fan isn't perfectly aligned. 3. **Push-Pin Attachment:** The use of push-pins provides a consistent pressure (compression force) against the electronic chip, which is vital for the Thermal Interface Material to work correctly. --- ### 4. Application Examples This specific heat sink is typically found in: * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. * **Power Electronics:** Cooling voltage regulators or high-power MOSFETs.