The **ATS-08F-185-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 30mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 3.35°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **08**: Series designation. - **F**: Fin pitch/density (Fine). - **185**: Specific model dimensions. - **C2**: Thermal interface material and finish code (Blue Anodized). - **R0**: Revision or RoHS compliance status. --- ### 3. Key Features & Benefits * **High Aspect Ratio Fins:** The straight fin design provides a large surface area for heat dissipation while maintaining low pressure drop. * **Push-Pin Attachment:** Features a flexible, tool-less mounting system. The plastic push-pins are designed to fit into specific PCB holes (usually 3.0mm), ensuring consistent pressure for optimal thermal contact. * **Pre-applied TIM:** It comes with a T766 thermal phase-change material already applied to the base, reducing assembly time and ensuring a reliable thermal bridge. * **Weight Efficiency:** Made of aluminum, it offers a balance between thermal conductivity and keeping the weight low on the PCB. --- ### 4. Application Areas This specific heat sink is typically used in the following electronics: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling of large MOSFETs or integrated power modules.