ATS-08F-162-C2-R0
AI

The **ATS-08F-162-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed primarily for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs.
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## Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-08F-162-C2-R0 |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (2-Pin) |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | 3.62°C/W (at 200 LFM) |
| **Weight** | ~40.5 grams |
| **Flow Orientation** | Vertical or Horizontal (High-fin density) |
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## Detailed Electronic Functionality
### 1. Thermal Management
The primary role of this part is **passive thermal dissipation**. It increases the surface area of a semiconductor device, allowing heat to transfer more efficiently from the silicon die to the surrounding air. The "C2" designation refers to the specific high-performance thermal interface material (TIM) or specific coating used to enhance conductivity.
### 2. Push-Pin Attachment Mechanism
Unlike adhesive-based heat sinks, the `-R0` variant uses a **push-pin and spring system**:
* **Mechanical Stability:** It provides consistent pressure across the chip surface.
* **Reliability:** It is less prone to failure due to thermal cycling compared to thermal tape.
* **PCB Requirements:** Requires two pre-drilled holes on the PCB for installation.
### 3. Airflow Efficiency
The fin geometry is optimized for "Cross-Cut" or "Straight Fin" airflow.
* **Low Airflow:** Operates at ~3.62°C/W.
* **High Airflow:** As air speed increases (LFM - Linear Feet per Minute), the thermal resistance drops significantly, allowing the electronic component to stay within its safe Operating Junction Temperature ($T_j$).
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## Component Materials
* **Body:** Aluminum 6063 (High thermal conductivity).
* **Springs:** Stainless steel for long-term tension.
* **Pins:** Typically brass or plastic, depending on the specific sub-model revision.
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- ⤷
What are the PCB hole diameter requirements for the push-pin mounting?
- ⤷ How does the thermal resistance change at higher airflows like 500 LFM?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied material?