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  • ATS-08F-162-C2-R0

  • AI
    The **ATS-08F-162-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed primarily for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ## Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-08F-162-C2-R0 | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (2-Pin) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 3.62°C/W (at 200 LFM) | | **Weight** | ~40.5 grams | | **Flow Orientation** | Vertical or Horizontal (High-fin density) | --- ## Detailed Electronic Functionality ### 1. Thermal Management The primary role of this part is **passive thermal dissipation**. It increases the surface area of a semiconductor device, allowing heat to transfer more efficiently from the silicon die to the surrounding air. The "C2" designation refers to the specific high-performance thermal interface material (TIM) or specific coating used to enhance conductivity. ### 2. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the `-R0` variant uses a **push-pin and spring system**: * **Mechanical Stability:** It provides consistent pressure across the chip surface. * **Reliability:** It is less prone to failure due to thermal cycling compared to thermal tape. * **PCB Requirements:** Requires two pre-drilled holes on the PCB for installation. ### 3. Airflow Efficiency The fin geometry is optimized for "Cross-Cut" or "Straight Fin" airflow. * **Low Airflow:** Operates at ~3.62°C/W. * **High Airflow:** As air speed increases (LFM - Linear Feet per Minute), the thermal resistance drops significantly, allowing the electronic component to stay within its safe Operating Junction Temperature ($T_j$). --- ## Component Materials * **Body:** Aluminum 6063 (High thermal conductivity). * **Springs:** Stainless steel for long-term tension. * **Pins:** Typically brass or plastic, depending on the specific sub-model revision. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the push-pin mounting?
    • ⤷ How does the thermal resistance change at higher airflows like 500 LFM?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied material?