The **ATS-08F-161-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components using Advanced Thermal Solutions' (ATS) proprietary "push-pin" attachment mechanism. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-08F-161-C2-R0 | | **Type** | Top Mount Heatsink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | XCUT (Straight fins with cross-cuts) | --- ### 2. Design Characteristics This specific model belongs to the **pushPIN™** Heat Sink Assembly line. Key design elements include: * **XCUT Fin Design:** The fins are designed with cross-cuts. This allows for multi-directional airflow, making the heatsink effective even in systems where the direction of the cooling fan's exhaust might be inconsistent. * **Material Efficiency:** Made from high-grade aluminum, providing a balance between lightweight construction and high thermal conductivity. * **Blue Anodized Coating:** The blue finish is not purely aesthetic; anodizing increases the surface emissivity and protects the aluminum from corrosion and wear. ### 3. Attachment Mechanism (Push-Pin) The "R0" suffix indicates a specific attachment kit. This system replaces messy adhesives or thermal tapes with a mechanical solution: * **Spring-Loaded Pins:** Ensure even pressure across the surface of the processor, optimizing the interface with the Thermal Interface Material (TIM). * **Ease of Installation:** It uses pre-drilled holes in the PCB, allowing for secure mounting that is resistant to vibration and mechanical shock. --- ### 4. Performance Data (Thermal Resistance) Thermal resistance is measured in °C/W (lower is better). Performance varies based on the velocity of the airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.74 | | 300 (1.5 m/s) | 2.02 | | 500 (2.5 m/s) | 1.51 | | 700 (3.5 m/s) | 1.28 | --- ### 5. Common Applications * **CPUs/GPUs:** For specialized industrial processors. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Telecommunications:** Cooling ASICs in networking switches and routers.