ATS-08F-155-C2-R0
AI

The **ATS-08F-155-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components like CPUs, GPUs, and FPGAs.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-08F-155-C2-R0 |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm |
| **Fin Type** | Fine Pitch (Straight Fin) |
| **Thermal Resistance** | 5.37°C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
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## 2. Key Components & Design Features
### A. Push-Pin Attachment
The "-R0" suffix indicates a specific mounting style. It uses **plastic push-pins** combined with compression springs. This ensures:
* **Constant Pressure:** Maintains optimal contact between the heat sink and the chip.
* **Ease of Assembly:** Quick installation without specialized tools.
* **PCB Compatibility:** Requires pre-drilled holes in the PCB.
### B. Straight Fin Geometry
The "Fine Pitch" design is optimized for **forced air cooling**. Unlike cross-cut or pin-fin designs, straight fins allow air to flow linearly across the surface, reducing pressure drop while maximizing surface area for heat dissipation.
### C. Thermal Interface Material (TIM)
This part comes pre-applied with **T766 thermal grease**.
* It fills microscopic air gaps between the component and the heat sink.
* It reduces thermal resistance at the contact point, which is critical for high-wattage components.
### D. Blue Anodized Finish
The blue color isn't just aesthetic. Anodizing provides:
* **Corrosion Resistance:** Protects the aluminum from environmental oxidation.
* **Electrical Insulation:** Adds a thin layer of dielectric strength to the surface.
* **Emissivity:** Slightly improves heat radiation compared to raw aluminum.
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## 3. Thermal Performance Profile
Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 5.37 |
| 300 | 3.85 |
| 400 | 3.10 |
| 500 | 2.62 |
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- ⤷
What are the PCB hole diameter requirements for the ATS-08F push-pin system?
- ⤷ How does the T766 thermal material compare to phase-change materials?
- ⤷ What are the alternatives to push-pin mounting for this specific heat sink size?