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  • ATS-08F-155-C2-R0

  • AI
    The **ATS-08F-155-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-08F-155-C2-R0 | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Resistance** | 5.37°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ## 2. Key Components & Design Features ### A. Push-Pin Attachment The "-R0" suffix indicates a specific mounting style. It uses **plastic push-pins** combined with compression springs. This ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink and the chip. * **Ease of Assembly:** Quick installation without specialized tools. * **PCB Compatibility:** Requires pre-drilled holes in the PCB. ### B. Straight Fin Geometry The "Fine Pitch" design is optimized for **forced air cooling**. Unlike cross-cut or pin-fin designs, straight fins allow air to flow linearly across the surface, reducing pressure drop while maximizing surface area for heat dissipation. ### C. Thermal Interface Material (TIM) This part comes pre-applied with **T766 thermal grease**. * It fills microscopic air gaps between the component and the heat sink. * It reduces thermal resistance at the contact point, which is critical for high-wattage components. ### D. Blue Anodized Finish The blue color isn't just aesthetic. Anodizing provides: * **Corrosion Resistance:** Protects the aluminum from environmental oxidation. * **Electrical Insulation:** Adds a thin layer of dielectric strength to the surface. * **Emissivity:** Slightly improves heat radiation compared to raw aluminum. --- ## 3. Thermal Performance Profile Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 5.37 | | 300 | 3.85 | | 400 | 3.10 | | 500 | 2.62 | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the ATS-08F push-pin system?
    • ⤷ How does the T766 thermal material compare to phase-change materials?
    • ⤷ What are the alternatives to push-pin mounting for this specific heat sink size?