The **ATS-08F-15-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices (SMDs). --- ### 1. Key Technical Specifications The following table summarizes the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.44°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 25.00mm | | **Fin Pattern** | XC (Extra Coarse) / Square | --- ### 2. Physical Design and Construction The "08F" in the part number indicates a specific configuration within the ATS product line. * **Fin Style:** It utilizes a **Square Fin** (cross-cut) design. This allows for multi-directional airflow, meaning the heat sink remains effective regardless of whether the air is blowing horizontally or vertically across the PCB. * **Material (Aluminum):** Provides a balance between high thermal conductivity and low weight. The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity for better radiant heat transfer. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material or a similar high-performance thermal pad on the base to ensure optimal heat transfer between the component and the heat sink. --- ### 3. Attachment Mechanism: pushPIN™ One of the defining "electronic parts" of this assembly is the mounting hardware: 1. **Push-Pins:** These are inserted through pre-drilled holes in the PCB. They allow for easy installation without the need for specialized tools. 2. **Compression Springs:** The pins are equipped with springs that provide a calculated "downward force" (pressure). This ensures the heat sink stays in firm contact with the chip, compensating for mechanical shocks or thermal expansion. --- ### 4. Performance Context This heat sink is categorized for use in environments where airflow (LFM - Linear Feet per Minute) is present. * **Low Airflow:** At 100 LFM, the resistance is **7.44°C/W**. * **High Airflow:** At 700 LFM, the resistance drops significantly to approximately **1.59°C/W**, making it highly efficient for cooled server racks or high-speed telecommunications equipment.