ATS-08F-147-C3-R0
AI

The **ATS-08F-147-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling electronic components such as processors, ASICs, and power modules.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 35mm x 35mm x 10mm |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight |
| **Thermal Resistance** | 13.65 °C/W (@ 1.0 m/s) |
| **Flow Orientation** | Vertical |
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### 2. Key Component Features
#### A. Attachment Mechanism (pushPIN™)
This part utilizes a push-pin and brass spring assembly. This provides several advantages over traditional adhesive tapes:
* **Constant Pressure:** Ensures a consistent interface between the heat sink and the electronic chip.
* **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping.
* **Reusability:** Can be easily removed and reinstalled without damaging the PCB.
#### B. Material and Coating
* **Aluminum 6063:** Provides a high thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer.
#### C. Thermal Performance
The "C3" in the part number indicates a specific thermal interface material (TIM) or hardware configuration. These heat sinks are designed to manage heat in "convection-limited" environments where airflow is present.
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### 3. Application Use Cases
Electronic designers select this part for:
1. **Networking Equipment:** Routers and switches with small form-factor processors.
2. **Embedded Systems:** Industrial PCs where height constraints (10mm) are tight.
3. **Power Supplies:** Cooling voltage regulators or MOSFETs.
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### 4. Part Number Breakdown
The nomenclature follows a specific logic:
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **08:** Series Number
* **F:** Fin pitch/style
* **147:** Dimension/Template code
* **C3:** Performance/Hardware variant (specific spring/pin combination)
* **R0:** RoHS Compliance status
- ⤷What is the hole pattern required on the PCB for this heat sink?
- ⤷ How does the 'C3' hardware variant differ from 'C1' or 'C2'?
- ⤷ Can this heat sink be used with a thermal pad instead of the pre-applied TIM?