The **ATS-08F-147-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat-generating ICs (Integrated Circuits). --- ### 1. Technical Specifications The part number encodes specific data regarding its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 10.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 13.52°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components & Features #### A. Fin Profile (Straight Fin) The "F" in the part number indicates a **Straight Fin** geometry. This design is optimized for environments where there is a consistent airflow direction. The spacing between the fins allows for efficient heat dissipation into the surrounding air via forced convection. #### B. Attachment System (Push-Pins) The device uses a **Push-Pin and Spring** assembly. - **Purpose:** It provides a secure, tool-free mechanical attachment to the PCB. - **Springs:** The springs ensure that the heat sink applies constant pressure against the electronic component, which is critical for maintaining thermal contact. #### C. Thermal Interface Material (TIM) The base of the heat sink comes with **T766** pre-applied. - The TIM fills the microscopic air gaps between the chip surface and the heat sink base. - Without this, air (which is a poor conductor) would trap heat, leading to component failure. --- ### 3. Electronic Application This specific part is generally used for small-to-medium form factor electronics: * **Voltage Regulators:** Cooling high-power MOSFETs or VRMs. * **Embedded Systems:** Industrial PCs where space is limited (10mm height). * **Networking Gear:** Cooling chips on routers, switches, and small-scale servers. --- ### 4. Thermal Performance Comparison Thermal performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 13.52 | | **400** | 7.53 | | **600** | 5.83 |