The **ATS-08F-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.71°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Spring Type** | ATS-PPS-08 | --- ### 2. Design Characteristics This part belongs to the **pushPIN™** line, which is characterized by several engineering features: * **Fine Pitch Fins:** The "straight fin" design provides a high surface area to volume ratio, making it efficient for forced-air cooling environments. * **Integrated Spring:** The use of a compression spring ensures a consistent, high-pressure contact between the heat sink base and the electronic component, improving thermal transfer. * **Lightweight:** Made from aluminum, it provides a balance between thermal conductivity and weight, reducing mechanical stress on the PCB. * **Pre-applied TIM:** These parts often come with a pre-applied Thermal Interface Material (TIM) on the base to simplify the assembly process. --- ### 3. Part Number Decoding The part number `ATS-08F-141-C2-R0` can be broken down to understand its configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Specific series/pin configuration | | **F** | Fine pitch fin density | | **141** | Dimensional code for the footprint/height | | **C2** | Thermal Interface Material (TIM) and finish code | | **R0** | RoHS compliance and revision status | --- ### 4. Application Use Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling small chips on network switches or routers. 2. **Embedded Systems:** Industrial PCs and IoT gateways. 3. **Power Electronics:** Voltage regulators and power converters. ---