The **ATS-08F-134-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Shape** | Square, Fine Pitch (Cross-Cut) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 70mm x 70mm x 15mm | | **Thermal Resistance** | 4.44°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Cross-Cut Fin Design The heat sink features a **cross-cut** (grid) fin pattern. This design allows for multi-directional airflow, making it highly effective in systems where air direction might be turbulent or non-linear. The high fin density increases the surface area for heat dissipation. #### B. Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, this model uses a **push-pin and spring** assembly. - **Reliability:** Provides consistent pressure on the component, improving thermal transfer. - **Serviceability:** Can be removed and reinstalled more easily than thermal epoxy. - **Hole Pattern:** Requires pre-drilled holes in the PCB for secure mounting. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial Computing:** Embedded boards that require passive or active cooling. 3. **Power Electronics:** Cooling MOSFET arrays or power modules. --- ### 4. Thermal Performance Data Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 4.44 | | **400 (2.0 m/s)** | 2.06 | | **600 (3.0 m/s)** | 1.62 |